检测范围
Junction Leakage; Contact spiking; Hot Electrons; Latch-Up; Gate oxide defects/leakage; Poly-silicon Filaments; Substrate damageJunction Avalanche等
仪器参数
Junction Leakage; Contact spiking; Hot Electrons; Latch-Up; Gate oxide defects/leakage; Poly-silicon Filaments; Substrate damageJunction Avalanche等